Date of dispatch of this notice: 11/01/2021
External Reference: 2021-243173
TED Reference: 2021/S 010-017357
Contract award notice
Information
Published
Contract award notice
[NoticeContractAward]
[NoticeContractAwardSub]
[Directive201424]
[Section1]: [Ca]
I.1)
[NameAddressContact]
Education Procurement Service (EPS)
IE 6609370 G
University of Limerick
Castletroy
Co.Limerick
IE
[Contactpoint]:
Eimear Brennan
[AddressPhone]:
+353 61234901
[AddressEmail]:
eimear.brennan@ul.ie
[Internets]:
[UrlGeneral]:
http://www.educationprocurementservice.ie
[UrlBuyerprofile]:
https://irl.eu-supply.com/ctm/Company/CompanyInformation/Index/87073
I.2)
[JointProcurement]
[JointProcurementCentral]
I.4)
[CaType]
[MaintypePublicbody]
I.5)
[Mainactivity]
[MainactivEducation]
[Section2]: [Object]
II.1)
[QuantityScopeContract]
II.1.1)
[TitleContract]
UCC - RFT a Plasma Chemical Vapour Deposition System for Compound Semiconductors for the Tyndall National Institute
[Fileref]:
LEE701C
II.1.2)
[CpvMain]
38000000
-
II.1.3)
[TypeContract]
[Supplies]
II.1.4)
[DescrShort]
Tenders are sought for the supply, delivery and installation of a Plasma Chemical Vapour Deposition System for Compound Semiconductors for the Tyndall National Institute, UCC.
II.1.6)
[LotsInfo]
[DivisionLots]:
[No]
II.1.7)
[ValueTotal]
[LowestOffer]:
570500.00
EUR
/
[HighestOffer]:
716000.00
EUR
[TakenConsideration]
([ExclVat])
II.2)
[Description]
II.2.2)
[CpvAdditional]
31712330
-
38410000
-
38420000
-
38430000
-
38432000
-
38653300
-
38654000
-
38654100
-
II.2.4)
[DescrProcurement]
Tenders are sought for the supply, delivery and installation of a Plasma Chemical Vapour Deposition System for Compound Semiconductors for the Tyndall National Institute, UCC.
The Process & Product Development laboratories at Tyndall National Institute, UCC, fabricate a wide variety of Semiconductor devices, ranging from traditional Silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of plasma deposition by purchasing a fully functional load locked PECVD (Plasma Enhanced Chemical Vapour Deposition) or ICPCVD (Inductively Coupled Plasma Chemical Vapour Deposition) system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, deposition processes and control. The system offered must be suitable for use in a class 1000 cleanroom. As much of the work is in the area of Semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 10 x 10 mm and various irregular shaped pieces through to 200mm wafers, including 50mm, 100mm and 150mm wafers. Due to the novel nature of the R&D and customer base we also require that the system be able to deposit a variety of film materials from dielectrics SiO2 (silicon dioxide), Si3N4 (silicon nitride) and SiOxNy (silicon oxynitride) to amorphous Silicon and SiC (silicon carbide). We have defined the technical specification in terms of these specific film materials and also for the use of TEOS (Tetraethylorthosilicate) liquid precursor for conformal SiO2 deposition and the specific requirement for low temperature deposition of SiO2 and Si3N4 as well as these materials at the more standard deposition temperature of 300C. The tenderer should also supply as part of the tender response details of the recipes to be used for cleaning when changing between deposition materials. The tender response must clearly show the costs for all items and any additional options must be clearly identified as such and costed separately. As part of
The Process & Product Development laboratories at Tyndall National Institute, UCC, fabricate a wide variety of Semiconductor devices, ranging from traditional Silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of plasma deposition by purchasing a fully functional load locked PECVD (Plasma Enhanced Chemical Vapour Deposition) or ICPCVD (Inductively Coupled Plasma Chemical Vapour Deposition) system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, deposition processes and control. The system offered must be suitable for use in a class 1000 cleanroom. As much of the work is in the area of Semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 10 x 10 mm and various irregular shaped pieces through to 200mm wafers, including 50mm, 100mm and 150mm wafers. Due to the novel nature of the R&D and customer base we also require that the system be able to deposit a variety of film materials from dielectrics SiO2 (silicon dioxide), Si3N4 (silicon nitride) and SiOxNy (silicon oxynitride) to amorphous Silicon and SiC (silicon carbide). We have defined the technical specification in terms of these specific film materials and also for the use of TEOS (Tetraethylorthosilicate) liquid precursor for conformal SiO2 deposition and the specific requirement for low temperature deposition of SiO2 and Si3N4 as well as these materials at the more standard deposition temperature of 300C. The tenderer should also supply as part of the tender response details of the recipes to be used for cleaning when changing between deposition materials. The tender response must clearly show the costs for all items and any additional options must be clearly identified as such and costed separately. As part of
II.2.5)
[AwardCriteria]
[AwardCriteriaBelow]
[AwardCriterionQuality]
-
[AwardCriterionName]:
Technical
/
[Weighting]:
35%
[AwardCriterionQuality]
-
[AwardCriterionName]:
strategic Agreements
/
[Weighting]:
5%
[AwardCriterionQuality]
-
[AwardCriterionName]:
technical support & Maintenance
/
[Weighting]:
10%
[AwardCriterionQuality]
-
[AwardCriterionName]:
sample Assessment
/
[Weighting]:
10%
[Price]
-
[Weighting]:
40%
II.2.11)
[OptionsInfo]
[Options]:
[No]
II.2.13)
[EuProgrInfo]
[EuProgrRelated]:
[No]
II.2.14)
[InfoAdditional]
All information relating to tenders is published on www.etenders.gov.ie only
[Section4]: [Procedure]
IV.1)
[Description]
IV.1.1)
[TypeProcedure]
[ProctypeOpen]
IV.1.8)
[GpaInfo]
[GpaCovered]
: [No]
IV.2)
[InfoAdmin]
IV.2.1)
[PubPrevious]
[NumberOj]: 2019/S 179-435511
[Section5]: [AwardOfContract]
[ContractNumber]: 1
[TitleContract]: UCC - RFT a Plasma Chemical Vapour Deposition System for Compound Semiconductors for the Tyndall National Institute
V.2)
[AwardOfContract]
V.2.1)
[DateAward]
01/12/2020
V.2.2)
[AwardOffersInfo]
[OffersReceived]:
3
[OffersReceivedElectronic]:
3
[AwardedGroup]
:
[No]V.2.3)
[AwardedToName]
SENTECH Instruments GmbH
DE 137 205 446
Schwarzschildstrasse 2
Berlin
D-12489
DE
[AddressPhone]:
+49 3063925525
[AddressEmail]:
gerd.jungmann@sentech.de
[AddressFax]:
+49 3063925522
[Internet]:
http://www.sentech.de
[AwardedSme] : [Yes]
V.2.4)
[ValueContractInfo] ([ExclVat])
[LowestOffer]:
570500.00
EUR
/
[HighestOffer]:
716000.00
EUR
[TakenConsideration]
[Section6]: [InfoComplement]
VI.4)
[AppealsProcedure]
VI.4.1)
[AppealsBody]
Office of the High Court
Four Courts Ground Floor, Inns Quay
Dublin
7
IE
[AddressPhone]:
+353 18886000
[AddressEmail]:
HighCourtCentralOffice@courts.ie