II.1)
Scope of the procurement
UCC - High Performance Focussed Ion Beam Milling Capability
Reference number:
LEE945C
38000000
-
Laboratory, optical and precision equipments (excl. glasses)
Supplies
II.1.4)
Short description
The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of Semiconductor devices, ranging from traditional Silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of focussed ion beam (which can encompass Gallium beam/plasma/laser milling or a combination thereof) by purchasing a fully functional load locked system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, milling speed and quality of lamella preparation. As much of the work is in the area of Semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 0.3x0.3 mm and various irregular shaped pieces through to full wafers which could include wafers ranging in size from 50mm, 100mm, 150mm and 200mm wafers.
II.1.5)
Estimated total value
Value excluding VAT: 3700000.00
EUR
II.1.6)
Information about lots
This contract is divided into lots:
no
II.2.2)
Additional CPV code(s)
33696500
-
Laboratory reagents
33790000
-
Laboratory, hygienic or pharmaceutical glassware
33793000
-
Laboratory glassware
38437000
-
Laboratory pipettes and accessories
38519500
-
Laboratory microscope replacement bulbs
38653000
-
Apparatus for photographic laboratories
42623000
-
Milling machines
42637000
-
Machine tools for drilling, boring or milling metal
42637300
-
Machine tools for milling metal
II.2.4)
Description of the procurement
The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of Semiconductor devices, ranging from traditional Silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of focussed ion beam (which can encompass Gallium beam/plasma/laser milling or a combination thereof) by purchasing a fully functional load locked system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, milling speed and quality of lamella preparation. As much of the work is in the area of Semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 0.3x0.3 mm and various irregular shaped pieces through to full wafers which could include wafers ranging in size from 50mm, 100mm, 150mm and 200mm wafers. The tender response must clearly show the costs for all items and any additional options must be clearly identified as such and costed separately.
Price is not the only award criterion and all criteria are stated only in the procurement documents
Value excluding VAT: 3700000.00
EUR
II.2.7)
Duration of the contract, framework agreement or dynamic purchasing system
Duration in months:
12
This contract is subject to renewal:
yes
Description of renewals:
The Contracting Authority reserves the right to extend the Term for a period or periods of up to [1 Year] with a maximum of [2] such extension or extensions on the same terms and conditions, subject to the Contracting Authority’s obligations at law.
II.2.10)
Information about variants
Variants will be accepted:
no
II.2.11)
Information about options
Options:
no
II.2.13)
Information about European Union funds
The procurement is related to a project and/or programme financed by European Union funds:
no