II.1)
Scope of the procurement
Supply of a Flipchip packaging and assembly equipment
Reference number:
UCC/2016/46
39300000
-
Miscellaneous equipment
Supplies
II.1.4)
Short description
The Photonic Packaging Group at the Tyndall National Institute, University College Cork is
seeking to purchase a High Accuracy Photonic Flipchip Packaging and Assembly
piece of equipment. The purpose of the equipment is to support the development
and fabrication of fully assembled photonic prototypes.
II.1.5)
Estimated total value
Value excluding VAT: 600000.00
EUR
II.1.6)
Information about lots
This contract is divided into lots:
no
II.2.2)
Additional CPV code(s)
42921320
-
Packaging machines
II.2.3)
Place of performance
NUTS code:
IE025 -
South-West (IE)
II.2.4)
Description of the procurement
The Photonic Packaging Group at the Tyndall Institute, University College Cork is
seeking to purchase a High Accuracy Photonic Flipchip Packaging and Assembly
piece of equipment. The purpose of the equipment is to support the development
and fabrication of fully assembled photonic prototypes.
Price is not the only award criterion and all criteria are stated only in the procurement documents
Value excluding VAT: 600000.00
EUR
II.2.7)
Duration of the contract, framework agreement or dynamic purchasing system
Start:
01/12/2016
/
End:
This contract is subject to renewal:
no
II.2.10)
Information about variants
Variants will be accepted:
yes
II.2.11)
Information about options
Options:
yes
Description of options:
Additional warranty
II.2.13)
Information about European Union funds
The procurement is related to a project and/or programme financed by European Union funds:
yes
Identification of the project:
It may be co-funded through ERDF funding