UCC/2021/24 - Optical Fiber Array and Micro-lens Packaging Equipment

The photonic Packaging Group and the Tyndall Institute is seeking to purchase equipment to package optical components, specifically optical fibre and micro-optical components to photonic devices such as Photonic Integrated Circuits (PICs). These PIC devices include Silicon (Si), Indium Phosphide (InP) and Silicon Nitride (SiN) type photonic devices.

Supplies

13/10/2021 17:00:00

31712100-1  Microelectronic machinery and apparatus
31712000-0  Microelectronic machinery and apparatus and microsystems
38000000-5  Laboratory, optical and precision equipments (excl. glasses)
42921320-7  Packaging machines