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UCC/2016/46 - Supply of a Flipchip packaging and assembly equipment

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General information
Detailed description:

The Photonic Packaging Group at the Tyndall Institute, University College Cork is seeking to purchase a High Accuracy Photonic Flipchip Packaging and Assembly piece of equipment. The purpose of the equipment is to support the development and fabrication of fully assembled photonic prototypes.

Type of contract:

Supplies

Response deadline (Irish time):

21/10/2016 16:00:00

CPV codes:

39300000-5  Miscellaneous equipment
42921320-7  Packaging machines

Contracting authority:


University College Cork ( UCC )
6 Elderwood
College Rd
Cork
Ireland
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Contact:

Fiona Thomson
http://www.ucc.ie

Published notices
Notice Date of dispatch
Contract notice (TED (v209)) 21/09/2016 15:40
Contract award notice (TED (v209)) 10/07/2017 17:10
Supply of a Flipchip packaging and assembly equipment
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Supply of a Flipchip packaging and assembly equipment
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